Round-up
- Nvidia Takes $5.5B Charge, AMD $800M From New U.S. AI Chip Export Curbs Washington’s updated licensing rules blocked Nvidia’s H20 and AMD’s MI308 AI chips from China, forcing immediate financial writedowns and sparking a 5% sector-wide stock plunge123.
- TSMC Accelerates U.S. Investment Amid Geopolitical Pressures The Taiwanese foundry is expanding its Arizona fab complex with an additional $100B commitment, aiming to diversify supply chains as China exempts TSMC-made chips from retaliatory tariffs45.
- JEDEC Releases HBM4 Standard to Feed AI/ML Bandwidth Demands The new HBM4 spec doubles stacked die count to 24 layers and boosts bandwidth to 2.4 TB/s, targeting 2026 deployment for next-gen AI accelerators6.
Other Developments
- Lam Research donated a $40M advanced etch system to UC Berkeley’s nanofab lab to accelerate 2nm R&D7
- Cadence acquired Arm’s Artisan foundation IP business to strengthen SoC design capabilities8
- Huawei unveiled its CloudMatrix 384 AI accelerator using 100% optical interconnects to bypass U.S. export controls9
- SEMI warned Trump’s proposed tariffs could cost U.S. equipment makers $1B+ annually10
Did You Know? The average AI training cluster now consumes 20-50MW of power – equivalent to a small city9.
In-Depth
Government & Corporate Policy
- U.S. Restricts AI Chip Exports to China
- TSMC’s $100B U.S. Fab Expansion
- Taiwan Simulates U.S. Tariff Impacts
- Economy Ministry models 10-25% duty scenarios on foundry/logistics costs as Trump investigates imports5.
- ASML Warns of 2025-26 Uncertainty
- Lithography leader cites tariff risks and $400M/tool lead times complicating capacity planning11.
Economics & Finance
- Sector-Wide Stock Selloff
- Record Q1 Equipment Orders
- SEMI reports $38B in global fab tool bookings, but 15% may face tariff-related cancellations10.
- AI Chip Gray Market Emerges
- Brokers are stockpiling H100/H200 GPUs in Mexico/Singapore to bypass U.S.-China trade barriers9.
- Qualcomm Prepares Earnings Release
- Will detail impacts of automotive chip slowdown and AI edge processor investments on April 3012.
Technology & R&D
- HBM4 Standardization Completed
- JESD270-4 enables 24-Hi stacks, 2.4 TB/s bandwidth, and 12.8 GB/mm² density for AI/ML workloads6.
- Lam’s Berkeley Etch Donation
- Kiyo®/Flex® system allows 2nm gate-all-around transistor prototyping with <1nm CD uniformity7.
- Huawei’s Optical Interconnect Breakthrough
- CloudMatrix 384 uses 14 co-packaged LPO transceivers per die to eliminate copper bottlenecks9.
- Cadence-Arm IP Integration
- Acquisition gives Cadence foundational PDKs for Arm’s Neoverse CSS platforms at 3/2nm nodes8.
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https://www.reuters.com/technology/global-chip-stocks-slide-nvidia-warns-big-hit-us-export-curbs-2025-04-16/ ↩︎ ↩︎ ↩︎
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https://www.bloomberg.com/news/articles/2025-04-16/amd-sees-800-million-charge-from-us-export-controls-on-ai-chips ↩︎ ↩︎
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https://www.reuters.com/markets/us/us-stock-futures-drop-nvidia-tumbles-new-curbs-chip-exports-china-2025-04-16/ ↩︎ ↩︎ ↩︎
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https://www.nytimes.com/2025/04/16/business/china-taiwan-tariffs-chips.html ↩︎ ↩︎ ↩︎
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https://www.reuters.com/technology/taiwan-simulate-impact-us-tariffs-semiconductor-sector-2025-04-15/ ↩︎ ↩︎ ↩︎
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https://www.businesswire.com/newsroom/industry/technology/semiconductor ↩︎ ↩︎
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https://markets.ft.com/data/announce/detail?dockey=600-202504160900PR_NEWS_USPRX____NY65819-1 ↩︎ ↩︎
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https://markets.ft.com/data/announce/detail?dockey=600-202504160915BIZWIRE_USPRX____20250416_BW075935-1 ↩︎ ↩︎
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https://www.reuters.com/technology/us-tariffs-may-cost-chip-equipment-makers-more-than-1-billion-industry-estimates-2025-04-15/ ↩︎ ↩︎
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https://www.reuters.com/breakingviews/asml-holds-up-lens-chip-sectors-known-unknowns-2025-04-16/ ↩︎ ↩︎
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https://markets.ft.com/data/announce/detail?dockey=600-202504160900BIZWIRE_USPRX____20250416_BW495743-1 ↩︎